Capability

Leveraging advanced machines and extensive customization expertise, SAPA Technologies is well-equipped to fulfill diverse production needs. We specialize in customizing SMT nozzles, carriers, jigs, and supporters, ensuring precision for specific requirements.

If your application exceeds our current capabilities, reach out—we are eager to tailor solutions to address your unique challenges. Your intricate requirements inspire us to push boundaries and find innovative solutions, making SAPA Technologies your trusted partner in customized PCB solutions. Trust us to be your strategic partner in addressing the complexities of customized PCB solutions, ensuring that your unique production needs are not just met but exceeded. Your specific challenges are an opportunity for us to showcase our commitment to excellence and customer satisfaction.

PCB Dimensionsx: 50mm~1200mm, y: 40mm~480mm, thickness: 0.1mm~4.2mm
FinishesHASL, ENIG, Silver, OSP, All Finishes acceptable
MaterialRigid, Rogers 4000, Flex, Rigid Flex, Metal Clad, Others
Component Range0201 to 2.83’’
Components packageReels, Cut tape, Tube, Tray and Loose parts
SMT Placement Speed40,000CPH(Optimal)
Placement Accuracy±40㎛, BGA/QFP ±50㎛
BGA (Ball Grid Array)Ball amount:x:2 ~ 50, y: 2~50 (2500 balls maximum) Pitch: x: 0.2mm~5mm, y: 0.2mm~5mm
LGA (Land Grid Array), QFN (Quad Flat No-leads), ConnectorsMinimal Lead Pitch 0.2mm